Molex美国

CONN RCPT 50POS SMD GOLD

针数50
排数2
间距400 µm
公母母

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技术参数

针数50
排数2
间距400 µm
公母母
环境与封装
Height Above Board0.053" (1.35mm)
Mated Stacking Heights1.5mm
Mounting TypeSurface Mount
PackageTape & Reel (TR); Cut Tape (CT); Digi-Reel®
其他
Base Product Number051338
Connector TypeReceptacle, Center Strip Contacts
Contact FinishGold
Contact Finish Thickness8.00µin (0.203µm)
FeaturesSolder Retention
MfrMolex
Number of Positions50
Number of Rows2
Pitch0.016" (0.40mm)
Product StatusActive
SeriesSlimStack 51338

技术资料