370
Serpac美国

BREADBRD PREPUNCHED INSULAT NPTH

查看国产替代问 AI FAE

全部替代型号

查看完整报告

技术参数

环境与封装
Size / Dimension6.50" L x 4.50" W (165.1mm x 114.3mm)
其他
Board Thickness0.062" (1.57mm) 1/16"
Circuit Pattern-
Edge Contacts-
Hole Diameter0.038" (0.97mm)
ManufacturerSerpac
Material-
PackagingBulk
Part StatusObsolete
Pitch0.100" (2.54mm)
PlatingNon-Plated Through Hole (NPTH)
Proto Board TypeBreadboard, Prepunched Insulating
Series-

器件图片

技术资料

该型号暂未收录资料。