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| 环境与封装 | |
|---|---|
| Storage/Refrigeration Temperature | - |
| Thermal Conductivity | 1.8W/m-K |
| Thermal Resistivity | - |
| 其他 | |
| Adhesive | Tacky - One Side |
| Backing, Carrier | - |
| Color | Gray |
| Digi-Key Storage | - |
| Manufacturer | Laird Technologies - Thermal Materials |
| Material | Silicone, Ceramic Filled |
| Outline | 457.20mm x 457.20mm |
| Packaging | Bulk |
| Part Status | Last Time Buy |
| Series | Tflex™ HR400 |
| Shape | Square |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Shipment |
| Thickness | 0.148" (3.75mm) |
| Type | Gap Filler Pad, Sheet |
| Usage | Multi |
技术资料
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