针数30
排数2
间距2.54 mm
公母母
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针数30
排数2
间距2.54 mm
公母母
| 电源 | |
|---|---|
| Current Rating (Amps) | - |
| Voltage Rating | - |
| 环境与封装 | |
| Insulation Height | 0.083" (2.10mm) |
| Mated Stacking Heights | - |
| Mounting Type | Through Hole |
| Operating Temperature | -55°C ~ 125°C |
| 其他 | |
| Applications | - |
| Connector Type | Receptacle |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | - |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
| Contact Finish Thickness - Post | - |
| Contact Length - Post | 0.082" (2.08mm) |
| Contact Material | Beryllium Copper |
| Contact Shape | Circular |
| Contact Type | Female Socket |
| Fastening Type | Push-Pull |
| Features | - |
| Ingress Protection | - |
| Insulation Color | Black |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | - |
| Mfr | Samtec Inc. |
| Number of Positions | 30 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Packaging | Tube |
| Part Status | Active |
| Pitch - Mating | 0.100" (2.54mm) |
| Row Spacing - Mating | 0.100" (2.54mm) |
| Series | SDL |
| Style | Board to Board |
| Termination | Solder |