全部替代型号

查看完整报告

技术参数

环境与封装
Operating Temperature-
PackageTape & Reel (TR)
Size / Dimension5mm L x 6mm W x 0.82mm H
其他
Carrier Network-
Class-
Core Processor-
Features-
FormatESIM (MFF2)
Memory-
MfrHologram, Inc.
Network Technology2G, 3G, 4G LTE IOT
Product StatusDiscontinued at Digi-Key
Series-

器件图片

技术资料