X2000

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MULTI-CPU HETEROGENEOUS MULTI-AP

全部替代型号

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技术参数

电源
Voltage - I/O1.8V, 3.3V
环境与封装
Mounting TypeSurface Mount
Operating Temperature-40°C~85°C(TA)
PackageTray
Package / Case270-LFBGA
Supplier Device Package270-BGA (12x12)
其他
Additional InterfacesDMA, I²C, I²S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
Co-Processors/DSP-
Core ProcessorXBurst® 2
Display & Interface ControllersDVP, LCD, MIPI-CSI, MIPI-DSI
Ethernet10/100/1000Mbps (1)
Graphics AccelerationNo
MfrLumissil Microsystems
Number of Cores/Bus Width-
Product StatusActive
RAM ControllersLPDDR3
SATA-
Security FeaturesAES, RSA, TRNG, MD5, SHA, SHA2
Series-
Speed1.2GHz
USBUSB 2.0 OTG (1)

技术资料