全部替代型号
查看完整报告技术参数
| 环境与封装 | |
|---|---|
| Package | Bulk |
| 其他 | |
| Contents | Board(s) |
| Function | Electromechanical |
| Mfr | Seeed Technology Co., Ltd |
| Platform | Tessel |
| Product Status | Active |
| Series | - |
| Type | Relay |
| Utilized IC / Part | IM02D |
技术资料
该型号暂未收录资料。
| 环境与封装 | |
|---|---|
| Package | Bulk |
| 其他 | |
| Contents | Board(s) |
| Function | Electromechanical |
| Mfr | Seeed Technology Co., Ltd |
| Platform | Tessel |
| Product Status | Active |
| Series | - |
| Type | Relay |
| Utilized IC / Part | IM02D |
该型号暂未收录资料。