间距500 µm
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间距500 µm
| 环境与封装 | |
|---|---|
| Mounting Type | Through Hole |
| Operating Temperature | - |
| Package | Bag |
| 其他 | |
| Contact Finish - Mating | - |
| Contact Finish - Post | - |
| Contact Finish Thickness - Mating | - |
| Contact Finish Thickness - Post | - |
| Contact Material - Mating | - |
| Contact Material - Post | - |
| Contact Resistance | - |
| Features | - |
| Housing Material | - |
| Material Flammability Rating | - |
| Mfr | Ironwood Electronics |
| Number of Positions or Pins (Grid) | 153 (12 x 13) |
| Pitch - Mating | 0.020" (0.50mm) |
| Pitch - Post | 0.020" (0.50mm) |
| Product Status | Active |
| Series | - |
| Termination | Solder |
| Termination Post Length | - |
| Type | BGA |
技术资料
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