BOARD TO BOARD

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针数78
排数2
间距350 µm
公母公

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技术参数

针数78
排数2
间距350 µm
公母公
环境与封装
Height Above Board0.026" (0.65mm)
Mated Stacking Heights0.8mm
Mounting TypeSurface Mount
PackageTape & Reel (TR); Cut Tape (CT); Digi-Reel®
其他
Base Product Number145897
Connector TypePlug, Outer Shroud Contacts
Contact FinishGold
Contact Finish Thickness-
FeaturesSolder Retention
MfrKYOCERA AVX
Number of Positions78
Number of Rows2
Pitch0.014" (0.35mm)
Product StatusActive
Series5897, Kyocera

技术资料

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