Molex美国

0.8 BT BTB H0.75 8P REC.

针数8
排数2
间距800 µm
公母母

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技术参数

针数8
排数2
间距800 µm
公母母
环境与封装
Height Above Board0.030" (0.75mm)
Mated Stacking Heights0.8mm
Mounting TypeSurface Mount
PackageTape & Reel (TR)
其他
Base Product Number207419
Connector TypeReceptacle, Center Strip Contacts
Contact FinishGold
Contact Finish Thickness4.00µin (0.100µm)
FeaturesSolder Retention
MfrMolex
Number of Positions8 (4 + 4 Power)
Number of Rows2
Pitch0.031" (0.80mm)
Product StatusActive
SeriesSlimStack 207419

技术资料