MICROSD BREAKOUT BOARD W/ VREG

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技术参数

环境与封装
Package-
Package AcceptedmicroSD™ Card
Size / Dimension0.940" L x 0.900" W (23.87mm x 22.86mm)
其他
Board Thickness0.120" (3.05mm)
Material-
MfrPololu Corporation
Number of Positions8
Pitch0.100" (2.54mm)
Product StatusActive
Proto Board TypePlated Through Hole to Plated Through Hole
Series-

技术资料

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