310
Serpac美国

BREADBRD PREPUNCHED INSULAT NPTH

全部替代型号

查看完整报告

技术参数

环境与封装
PackageBulk
Size / Dimension3.24" L x 1.88" W (82.3mm x 47.8mm)
其他
Board Thickness0.065" (1.65mm)
Circuit Pattern-
Edge Contacts-
Hole Diameter0.038" (0.97mm)
Material-
MfrSerpac
Pitch0.100" (2.54mm)
PlatingNon-Plated Through Hole (NPTH)
Product StatusObsolete
Proto Board TypeBreadboard, Prepunched Insulating
Series-

器件图片

技术资料