Serpac美国

BREADBRD PREPUNCHED INSULAT NPTH

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技术参数

环境与封装
PackageBulk
Size / Dimension5.75" L x 4.50" W (146.1mm x 114.3mm)
其他
Board Thickness0.062" (1.58mm)
Circuit Pattern-
Edge Contacts-
Hole Diameter0.038" (0.97mm)
MaterialFR4 Epoxy Glass
MfrSerpac
Pitch0.100" (2.54mm)
PlatingNon-Plated Through Hole (NPTH)
Product StatusObsolete
Proto Board TypeBreadboard, Prepunched Insulating
Series-

技术资料

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