针数8
排数1
间距2.54 mm
公母公
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技术参数
针数8
排数1
间距2.54 mm
公母公
| 电源 | |
|---|---|
| Current Rating (Amps) | - |
| Voltage Rating | - |
| 环境与封装 | |
| Insulation Height | 0.585" (14.86mm) |
| Mated Stacking Heights | - |
| Mounting Type | Through Hole |
| Operating Temperature | -55°C ~ 125°C |
| 其他 | |
| Applications | - |
| Connector Type | Header |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | - |
| Contact Finish Thickness - Mating | 20.0µin (0.51µm) |
| Contact Finish Thickness - Post | - |
| Contact Length - Mating | 0.125" (3.18mm) |
| Contact Length - Post | 0.125" (3.18mm) |
| Contact Material | - |
| Contact Shape | Circular |
| Contact Type | Male Pin |
| Fastening Type | Push-Pull |
| Features | - |
| Ingress Protection | - |
| Insulation Color | Black |
| Insulation Material | Liquid Crystal Polymer (LCP), Glass Filled |
| Material Flammability Rating | - |
| Mfr | Samtec Inc. |
| Number of Positions | 8 |
| Number of Positions Loaded | All |
| Number of Rows | 1 |
| Overall Contact Length | 0.835" (21.21mm) |
| Packaging | Tube |
| Part Status | Active |
| Pitch - Mating | 0.100" (2.54mm) |
| Row Spacing - Mating | - |
| Series | BHS |
| Shrouding | Unshrouded |
| Style | Board to Board |
| Termination | Solder |