DIP600T300P08

在产适配器、转接板

DIP-8 (0.6" BODY) TO DIP-8 (0.3"

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技术参数

环境与封装
PackageBulk
Package Accepted-
Size / Dimension0.700" L x 0.400" W (17.78mm x 10.16mm)
其他
Base Product NumberDIP600
Board Thickness0.063" (1.60mm)
MaterialFR4 Epoxy Glass
MfrChip Quik Inc.
Number of Positions8
Pitch0.100" (2.54mm)
Product StatusActive
Proto Board TypeDIP to DIP
SeriesProto-Advantage

技术资料