全部替代型号
查看完整报告技术参数
| 环境与封装 | |
|---|---|
| Package | Bulk |
| Size / Dimension | 2.10" L x 1.26" W (53.3mm x 32.0mm) |
| 其他 | |
| Base Product Number | EXN-23400 |
| Board Thickness | 0.063" (1.60mm) |
| Circuit Pattern | Pad Per Hole (Round) |
| Edge Contacts | - |
| Hole Diameter | 0.051" (1.30mm) |
| Material | FR4 Epoxy Glass |
| Mfr | Bud Industries |
| Pitch | 0.100" (2.54mm) |
| Plating | Plated Through Hole (PTH) |
| Product Status | Active |
| Proto Board Type | Breadboard, General Purpose |
| Series | EXN |