JET551AX30T5

焊料

JET PRINTING SOLDER PASTE SN63/P

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技术参数

环境与封装
Storage/Refrigeration Temperature-
其他
CompositionSn63Pb37 (63/37)
Diameter-
Flux TypeNo-Clean
FormSyringe, 3.53 oz (100g)
ManufacturerChip Quik Inc.
Melting Point361°F (183°C)
PackagingBulk
Part StatusActive
ProcessLeaded
SeriesCHIPQUIK®
Shelf Life12 Months
Shelf Life StartDate of Manufacture
Shipping Info-
TypeSolder Paste
Weight-
Wire Gauge-

技术资料

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