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| 环境与封装 | |
|---|---|
| Inner Dimension | - |
| Outer Dimension | 1.950" L x 1.350" W (49.53mm x 34.29mm) |
| Package | Bulk |
| Thermal Center Pad | - |
| 其他 | |
| Material | Stainless Steel |
| Mfr | Chip Quik Inc. |
| Number of Positions | 40 |
| Pitch | 0.020" (0.50mm) |
| Product Status | Active |
| Series | Proto-Advantage PA |
| Thickness | 0.0040" (0.102mm) |
| Type | TSOP |