TS391AX

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THERMALLY STABLE SOLDER PASTE NO

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技术参数

环境与封装
PackageBulk
Storage/Refrigeration Temperature68°F ~ 77°F (20°C ~ 25°C)
其他
Base Product NumberTS391A
CompositionSn63Pb37 (63/37)
Diameter-
Flux TypeNo-Clean
FormSyringe, 0.53 oz (15g), 5cc
Melting Point361°F (183°C)
Mesh Type4
MfrChip Quik Inc.
ProcessLeaded
Product StatusActive
Series-
Shelf Life12 Months
Shelf Life StartDate of Manufacture
Shipping Info-
TypeSolder Paste
Wire Gauge-

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