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| 环境与封装 | |
|---|---|
| Package | Bag |
| Package Accepted | Non Specific |
| Size / Dimension | 0.500" L x 0.800" W (12.70mm x 20.30mm) |
| 其他 | |
| Board Thickness | 0.031" (0.79mm) 1/32" |
| Material | FR4 Epoxy Glass |
| Mfr | Capital Advanced Technologies |
| Number of Positions | 8 |
| Pitch | - |
| Product Status | Active |
| Proto Board Type | Through Hole to SIP |
| Series | 1000, UNI-SIP™ |
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