全部替代型号
查看完整报告技术参数
| 环境与封装 | |
|---|---|
| Package | Bag |
| Package Accepted | Non Specific |
| Size / Dimension | 1.000" L x 1.402" W (25.40mm x 35.60mm) |
| 其他 | |
| Board Thickness | 0.031" (0.79mm) 1/32" |
| Material | FR4 Epoxy Glass |
| Mfr | Capital Advanced Technologies |
| Number of Positions | 14 |
| Pitch | - |
| Product Status | Active |
| Proto Board Type | Through Hole to SIP |
| Series | 5000, UNI-SIP™ |
器件图片
技术资料
该型号暂未收录资料。