全部替代型号
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技术参数
| 环境与封装 | |
|---|---|
| Flash Size | - |
| Operating Temperature | -40°C~100°C(TJ) |
| Package | Tray |
| Package / Case | 225-LFBGA, CSPBGA |
| RAM Size | 256KB |
| Supplier Device Package | 225-CSPBGA (13x13) |
| 其他 | |
| Architecture | MCU, FPGA |
| Base Product Number | XC7Z007 |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Core Processor | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Mfr | AMD Xilinx |
| Number of I/O | 54 |
| Peripherals | DMA |
| Primary Attributes | Artix™-7 FPGA, 23K Logic Cells |
| Product Status | Active |
| Series | Zynq®-7000 |
| Speed | 667MHz |
器件图片
技术资料
该型号暂未收录资料。