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Technical parameters

Environment and package
Mounting TypeFixed
PackageBulk
Other
Board TypeEvaluation Platform
ContentsBoard(s)
Core ProcessorARM® Cortex®-M3
Interconnect System-
MfrSeeed Technology Co., Ltd
Operating System-
PlatformTessel
Product StatusObsolete
SeriesLPC1800
Suggested Programming EnvironmentJavascript
TypeMCU 32-Bit
Utilized IC / PartLPC1830

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