All alternatives

View full report

Technical parameters

Environment and package
PackageBulk
Package AcceptedMSOP, SOIC, TSSOP
Size / Dimension0.550" L x 0.425" W (13.97mm x 10.80mm)
Other
Board Thickness-
Material-
MfrAdafruit Industries LLC
Number of Positions8
Pitch-
Product StatusActive
Proto Board TypeSMD to DIP
Series-

Documents