MulticoreUnited Kingdom
63S4 WS200 ACP 500G JAR
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Storage/Refrigeration Temperature | 32°F~50°F(0°C~10°C) |
| Other | |
| Composition | Sn63Pb37 (63/37) |
| Diameter | - |
| Flux Type | Water Soluble |
| Form | Jar, 17.64 oz (500g) |
| Melting Point | 361°F (183°C) |
| Mesh Type | 3 |
| Mfr | Multicore |
| Process | Leaded |
| Product Status | Obsolete |
| Series | WS200™ |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
| Type | Solder Paste |
| Wire Gauge | - |