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Technical parameters

Key specs

Positions120
AC and DC characteristics
Withdrawal force24 N
Environment and package
China RoHSe
Limiting temperature-55 ... +125 °C
Moisture Sensitivity Level (MSL)1 acc. to ECA/IPC/JEDEC J-STD-020D
Packaging size1
REACH ANNEX XIV substancesNot contained
REACH Annex XVII substancesNot contained
REACH SVHC substancesNot contained
RoHScompliant
Other
California Proposition 65 substancesNot contained
CategoryConnectors
Clearance distance≥0.2 mm Backplane
Colour (insert)Black
Connection typeMotherboard to daughtercard
Contact rows2
Contact spacing (mating side)0.8 mm
Contact spacing (termination side)0.8 mm
Coplanarity of contacts0.15 mm
Country of originChina
Creepage distance≥0.2 mm Backplane
Data rate25 Gbit/s
eCl@ss27460201 PCB connector (board connector)
ElementConnector
ELV statuscompliant
ETIMEC002637
European customs tariff number85366990
FeaturesThe sample packaging is not suitable for automated assembly.
GTIN5713140205451
IdentificationHD-Card Edge
Insertion force85 N
Isolation groupIIIa (175 ≤ CTI < 400)
Material (contacts)Copper alloy
Material flammability class acc. to UL 94V-0
Material (insert)Liquid crystal polymer (LCP)
Mating cycles200
Net weight16.7 g
Number of contacts120
Pack contentsSample
Performance level1
Process Sensitivity Level (PSL)R0 acc. to ECA/IPC/JEDEC J-STD-020D
Serieshar-flex®
Surface (contacts)Noble metal over Ni Mating side
Termination methodReflow soldering termination (SMT)
UNSPSC 24.039121415
Whitepaperhttps://d33y5j6752j001.cloudfront.net/asset/201312468866/document_ifd9i1f1bd01t6mk6dr9s45u2u

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