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Technical parameters

Environment and package
PackageBulk
Package AcceptedSOIC
Size / Dimension1.800" L x 0.450" W (45.72mm x 11.43mm)
Other
Base Product Number18-3500
Board Thickness0.062" (1.57mm) 1/16"
MaterialFR4 Epoxy Glass
MfrAries Electronics
Number of Positions18
Pitch0.050" (1.27mm)
Product StatusActive
Proto Board TypeSMD to DIP
SeriesCorrect-A-Chip® 350000

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