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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Size / Dimension | 5.75" L x 4.50" W (146.1mm x 114.3mm) |
| Other | |
| Board Thickness | 0.062" (1.58mm) |
| Circuit Pattern | - |
| Edge Contacts | - |
| Hole Diameter | 0.038" (0.97mm) |
| Material | FR4 Epoxy Glass |
| Mfr | Serpac |
| Pitch | 0.100" (2.54mm) |
| Plating | Non-Plated Through Hole (NPTH) |
| Product Status | Obsolete |
| Proto Board Type | Breadboard, Prepunched Insulating |
| Series | - |
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