Wakefield-VetteUnited States
HEATSINK CPU 25MM SQ W/DBL TAPE
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Technical parameters
| Environment and package | |
|---|---|
| Fin Height | 0.250" (6.35mm) |
| Package Cooled | BGA |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 12.00°C/W @ 500 LFM |
| Thermal Resistance @ Natural | - |
| Other | |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Diameter | - |
| Length | 0.984" (25.00mm) |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Mfr | Wakefield-Vette |
| Product Status | Obsolete |
| Series | 625 |
| Shape | Square, Pin Fins |
| Shelf Life | - |
| Type | Top Mount |
| Width | 0.984" (25.00mm) |
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