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Technical parameters

Environment and package
PackageBulk
Storage/Refrigeration Temperature-
Thermal Conductivity6.0W/m-K
Thermal Resistivity-
Other
Adhesive-
Backing, Carrier-
ColorGray
Digi-Key Storage-
MaterialBoron Nitride Filled
MfrLaird Technologies - Thermal Materials
Outline406.40mm x 406.40mm
Product StatusActive
SeriesTpli™ 200
ShapeSquare
Shelf Life24 Months
Shelf Life StartDate of Shipment
Thickness0.100" (2.54mm)
TypeGap Filler Pad, Sheet
Usage-

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