Laird Technologies - Thermal MaterialsUnited States
THERM PAD 406.4X406.4MM W/ADH
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Storage/Refrigeration Temperature | - |
| Thermal Conductivity | 6.0W/m-K |
| Thermal Resistivity | - |
| Other | |
| Adhesive | Adhesive - One Side |
| Backing, Carrier | - |
| Color | Gray |
| Digi-Key Storage | - |
| Material | Boron Nitride Filled |
| Mfr | Laird Technologies - Thermal Materials |
| Outline | 406.40mm x 406.40mm |
| Product Status | Active |
| Series | Tpli™ 200 |
| Shape | Square |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Shipment |
| Thickness | 0.108" (2.75mm) |
| Type | Gap Filler Pad, Sheet |
| Usage | - |
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