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Technical parameters
| Power | |
|---|---|
| 最大供电电压 | 30V |
| 最小供电电压 | 4V |
| 远程通道数 | 1 |
| AC and DC characteristics | |
| 输出精度 | 0.5℃ |
| Environment and package | |
| 封装类型1 | FLATPACK |
| 封装类型2 | LFCSP |
| 封装类型3 | TO52 |
| 封装类型4 | SOIC |
| 封装类型5 | DIE |
| 最大工作温度 | 150℃ |
| 最大检测温度 | 150℃ |
| 最小工作温度 | -55℃ |
| 最小检测温度 | -55℃ |
| Other | |
| 引脚数量1 | 2 |
| 引脚数量2 | 4 |
| 引脚数量3 | 3 |
| 引脚数量4 | 8 |
| 引脚数量5 | 0 |