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Technical parameters

Datasheet-verified parameters

18 items
ParameterValue and test conditionsSource
Package14-pin 2.5 × 3.0 × 0.83 mm³ LGA
Operating TemperatureMin: -40 °C, Max: +85 °C
RoHSMeets requirements of EC restriction of hazardous substances (RoHS) directive
Halogen-freeHalogen-free
Supply Voltage Internal DomainsMin: 1.71 V, Typ: 3.0 V, Max: 3.6 V
Supply Voltage I/O DomainMin: 1.2 V, Typ: 2.4 V, Max: 3.6 V
Current consumptionTyp: 925 µA, Max: 990 µA (Gyro and accel full operation mode, TA=25°C)
Current consumptionTyp: 3 µA, Max: 10 µA (Gyro and accel in suspend mode, TA=25°C)
Acceleration RangeSelectable: ±2 g, ±4 g, ±8 g, ±16 g
RangeSelectable: 125 dps, 250 dps, 500 dps, 1000 dps, 2000 dps
Resolution16 bit
FIFO buffer size1024 bytes
Absolute maximum ratings Voltage at Supply PinMin: -0.3 V, Max: 4.25 V
Absolute maximum ratings Voltage at Supply PinMin: -0.3 V, Max: 4.25 V
ESD HBMMax: 2 kV
ESD CDMMax: 500 V
Mechanical ShockMax: 10,000 g (Duration 200 μs, half sine)
NVM write-cyclesMin: 14 Cycles

Pinout and package

Figure 31: Pin-out top view
Figure 31: Pin-out top view
Package: 14-pin 2.5 × 3.0 × 0.83 mm³ LGA
PinNameFunctionSource
1SDO(SPI MISO / I2C SDA)
2ASDx (Secondary Magnetometer Interface)
3ASCx (Secondary Magnetometer Interface)
4INT1(Interrupt 1)
5VDDIO(I/O Supply Voltage)
6GNDIO(I/O Ground)
7GND(Ground)
8VDD(Internal Supply Voltage)
9INT2(Interrupt 2)
10OSCB(Secondary OIS Interface CSB)
11OSDO(Secondary OIS Interface MISO)
12CSB(SPI Chip Select)
13SCX(SPI SCK / I2C SCL)
14SDX(SPI MOSI / I2C SDA)

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