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Technical parameters

Key specs

Output voltage1.186 V
Output current200 mAMax
Input voltage-2.5 ~ -40 V
Dropout voltage-170 mVMax · IOUT=-200mA
Quiescent current-33 µATyp · IOUT=0μA

Datasheet-verified parameters

20 items
ParameterValue and test conditionsSource
Output Voltage可调输出 1.186V (GM1402ARHZ-R7)
Output Current200mA
Input Voltage Range-2.5V 至 -40V (Min -2.5V, Max -40V)
Dropout VoltageTyp -88mV, Max -170mV @ IOUT=-200mA
Quiescent CurrentTyp -33µA, Max -53µA @ IOUT=0µA
PackageMSOP-8
Operating Temperature-40°C 至 +125°C
GradeA (Commercial)
Shutdown CurrentTyp -3µA @ EN=GND
Output NoiseTyp 10µVrms @ 10Hz to 100kHz, VOUT=-1.5V/-3V/-5V
Line RegulationMax ±0.01%/V @ VIN=(VOUT-0.5V) to -45V
Load RegulationTyp 0.001%/mA, Max 0.006%/mA @ IOUT=-1mA to -200mA
Current Limit ThresholdTyp -240mA, Max -360mA
Thermal Shutdown ThresholdTyp 165°C @ TJ rising
Start-up TimeTyp 250µs @ VOUT=-1.2V; Typ 800µs @ VOUT=-5V
Power Supply Rejection RatioTyp 57dB @ 100kHz, VIN=-6V, VOUT=-5V
Minimum Output CapacitanceMin 1.5µF, Typ 2.2µF @ TA=-55°C to +125°C
Absolute Maximum RatingsVIN to GND: +0.3V to -50V; Storage Temp: -65°C to +150°C
Recommended Operating ConditionsVIN: -2.5V to -40V; TJ: -40°C to +125°C
Protection Features限流和过温保护
All parameters (4)ExpandCollapse
Power
工作电压40V
输出电压1.186V~45V
输出电流200mA
Other
输出极性负极

Pinout and package

图 6. MSOP 引脚配置(顶视图)
图 6. MSOP 引脚配置(顶视图)
Package: MSOP-8
PinNameFunctionSource
1VOUT: Regulated output voltage. Bypass VOUT to GND with a capacitor of 2.2µF or larger.
2FB: Adjustable input. External resistor divider sets output voltage.
3NC: No connect. Do not connect this pin.
4GND: Ground.
5EN: Enable pin. Drive EN to 2V or more above or below ground to enable the regulator; or drive EN low to disable. For auto-start, connect EN to VIN.
6SS: Soft-start pin.
7NC: No connect. Do not connect this pin.
8VIN: Regulator input supply. Bypass VIN to GND with a capacitor of 2.2µF or larger.
9EPAD: Exposed pad. The exposed pad on the bottom of the package enhances heat dissipation and is electrically connected to VIN inside the package. Connect to the VIN layer on the PCB for proper operation.

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