All alternatives
View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Package Accepted | SOIC, SSOP |
| Size / Dimension | - |
| Other | |
| Board Thickness | - |
| Material | - |
| Mfr | Global Specialties |
| Number of Positions | - |
| Pitch | - |
| Product Status | Obsolete |
| Proto Board Type | SMD to DIP |
| Series | - |
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