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Technical parameters
| Power | |
|---|---|
| 最大工作电压 | 3.6V |
| 最小工作电压 | 3V |
| 静态工作电流 | 3mA |
| Environment and package | |
| 封装类型1 | DIE |
| 封装类型2 | DFP |
| 封装类型3 | DIP |
| 封装类型4 | DFP |
| 尺寸规格2 | 18.29*12.7*3.05mm |
| 尺寸规格3 | 35.56*15.24*4.45mm |
| 尺寸规格4 | 16.51*16*4.29mm |
| Other | |
| 内存数据长度 | 8BIT |
| 字编码数 | 32Kb |
| 存储密度 | 262.144Kb |
| 引脚数量1 | 28 |
| 引脚数量2 | 28 |
| 引脚数量3 | 28 |
| 引脚数量4 | 36 |
| 最大存取时间 | 25ns |
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