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Technical parameters

Environment and package
Fin Height-
PackageBox
Package CooledIB918
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow-
Thermal Resistance @ Natural-
Other
Attachment Method-
Diameter-
Length-
Material-
Material Finish-
MfriBASE Technology
Product StatusActive
Series-
Shape-
TypeTop Mount
Width-

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