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Technical parameters

Key specs

ChannelP-channel
Drain-source voltage-12 VMin: -12 V (VGS = 0V,ID = -250μA)
Continuous drain current-4.3 AMax: -4.3 A (TA = 25°C,VGS = -4.5V),Max: -3.4 A (TA = 70°C,VGS = -4.5V)
On-resistance50 mΩMax · Max: 0.050 Ω (VGS = -4.5V,ID = -4.3A),Max: 0.085 Ω (VGS = -2.5V,ID = -2.5A),Max: 0.125 Ω (VGS = -1.8V,ID = -2.0A)
Gate threshold voltage-950 mVMax · Max: -0.95 V (VDS = VGS,ID = -250μA)

Datasheet-verified parameters

26 items
ParameterValue and test conditionsSource
ChannelP-Channel
Drain-to-Source Breakdown VoltageMin: -12 V (VGS = 0V, ID = -250μA)
Continuous Drain CurrentMax: -4.3 A (TA = 25°C, VGS = -4.5V); Max: -3.4 A (TA = 70°C, VGS = -4.5V)
Static Drain-to-Source On-ResistanceMax: 0.050 Ω (VGS = -4.5V, ID = -4.3A); Max: 0.085 Ω (VGS = -2.5V, ID = -2.5A); Max: 0.125 Ω (VGS = -1.8V, ID = -2.0A)
Gate Threshold VoltageMin: -0.40 V, Typ: -0.55 V, Max: -0.95 V (VDS = VGS, ID = -250μA)
PackageMicro3™ (SOT-23)
Junction and Storage Temperature Range-55 to +150 °C
Qualification LevelConsumer (per JEDEC JESD47F guidelines)
RoHS CompliantYes
Halogen-FreeYes
Pulsed Drain CurrentMax: -34 A
Power DissipationMax: 1.3 W (TA = 25°C); Max: 0.8 W (TA = 70°C)
Gate-to-Source VoltageMax: ± 8.0 V
Single Pulse Avalanche EnergyMax: 33 mJ
Maximum Junction-to-Ambient Thermal ResistanceTyp: 75 °C/W, Max: 100 °C/W
Forward TransconductanceMin: 8.6 S (VDS = -10V, ID = -4.3A)
Drain-to-Source Leakage CurrentMax: -1.0 μA (VDS = -12V, VGS = 0V); Max: -25 μA (VDS = -9.6V, VGS = 0V, TJ = 55°C)
Gate-to-Source Forward LeakageMax: -100 nA (VGS = -8.0V)
Total Gate ChargeTyp: 10 nC, Max: 15 nC (ID = -4.3A, VDS = -10V, VGS = -5.0V)
Input CapacitanceTyp: 830 pF (VGS = 0V, VDS = -10V, f = 1.0MHz)
Output CapacitanceTyp: 180 pF (VGS = 0V, VDS = -10V, f = 1.0MHz)
Reverse Transfer CapacitanceTyp: 125 pF (VGS = 0V, VDS = -10V, f = 1.0MHz)
Turn-On Delay TimeTyp: 11 ns (VDD = -6.0V, ID = -1.0A, RD = 6.0Ω, RG = 89Ω)
Rise TimeTyp: 32 ns (VDD = -6.0V, ID = -1.0A, RD = 6.0Ω, RG = 89Ω)
Turn-Off Delay TimeTyp: 250 ns (VDD = -6.0V, ID = -1.0A, RD = 6.0Ω, RG = 89Ω)
Fall TimeTyp: 210 ns (VDD = -6.0V, ID = -1.0A, RD = 6.0Ω, RG = 89Ω)
All parameters (7)ExpandCollapse
Environment and package
Package TypeMicro3TM (SOT-23)
Other
I_{D} @ T_{A} = 25^{}C-4.3 A (Max)
P_{D} @ T_{A} = 25^{}C1.3 W (Max)
R_{DS(on)}0.050 Ω (Max)
T_{J}, T_{STG}-55 to + 150 °C
V_{DSS}-12 V
V_{GS(th)}-0.55 V (Typ)

Pinout and package

HEXFET® Power MOSFET
HEXFET® Power MOSFET
Package: Micro3™ (SOT-23)
PinNameFunctionSource
1Gate (G)
2Source (S)
3Drain (D)

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