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Technical parameters

Environment and package
PackageBulk
Package AcceptedSSOP, TSSOP
Size / Dimension1.050" L x 0.450" W (26.67mm x 11.43mm)
Other
Base Product NumberPA-SSD3
Board Thickness-
Material-
MfrLogical Systems Inc.
Number of Positions20
Pitch0.026" (0.65mm)
Product StatusActive
Proto Board TypeSMD to DIP
Series-

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