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Technical parameters

Environment and package
PackageBulk
Package AcceptedTSOP
Size / Dimension1.650" L x 0.750" W (41.91mm x 19.05mm)
Other
Base Product NumberPA-TS1
Board Thickness-
Material-
MfrLogical Systems Inc.
Number of Positions32
Pitch0.020" (0.50mm)
Product StatusActive
Proto Board TypeSMD to DIP
Series-

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