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Technical parameters

Environment and package
Inner Dimension0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension1.950" L x 1.350" W (49.53mm x 34.29mm)
PackageBulk
Thermal Center Pad-
Other
MaterialStainless Steel
MfrChip Quik Inc.
Number of Positions52
Pitch0.039" (1.00mm)
Product StatusActive
SeriesProto-Advantage PA
Thickness0.0040" (0.102mm)
TypeTQFP

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