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Technical parameters

Environment and package
Package6L DFN
Package (mm)3x3
Other
Conv Loss (dB)6.5–7.5
DescriptionLow Conversion Loss
ECCNEAR99
ESD HBM (V)100
IIP3 (dBm)32
Max Freq.6 GHz
Max LO Drive (dBm)20
Min Freq.DC
PCN/EOLPCN – January 16, 2018: Wafer Fabrication Process, Ordering Code
Typ. Iso (dB) LO-IF25–40
Typ. Iso (dB) LO-RF25–40

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