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Technical parameters

Power
Voltage - I/O1.8V, 3.3V
Environment and package
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 85°C (TA)
PackageTray
Package / Case361-LFBGA
Supplier Device Package361-BGA (13x13)
Other
Additional InterfacesCANbus, eMMC/SD/SDIO, I²C, SPI, UART
Co-Processors/DSPMultimedia; NEON™ SIMD
Core ProcessorARM® Cortex®-A55, ARM® Cortex®-M33
Display & Interface ControllersLCD
EthernetGbE (2)
Graphics AccelerationNo
MfrRenesas Electronics Corporation
Number of Cores/Bus Width4 Core, 64-Bit
Product StatusActive
RAM ControllersDDR4, DDR3L
SATA-
Security FeaturesAES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
SeriesRZ/G
Speed200MHz, 1GHz
USBUSB 2.0 (2)

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