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Technical parameters

Key specs

ChannelN-channel
Drain-source voltage60 V
Continuous drain current2.5 ~ 3.2 A3.2 A (TA=25°C),2.5 A (TA=70°C)
On-resistance100 mΩMax · Max 0.10 Ω (VGS=10 V,ID=3.2 A),Max 0.13 Ω (VGS=4.5 V,ID=2.8 A)
Gate threshold voltage1 VMin · Min 1 V (VDS=VGS,ID=250 μA)

Datasheet-verified parameters

19 items
ParameterValue and test conditionsSource
ChannelN-Channel
Drain-Source Voltage60 V
Continuous Drain Current3.2 A (TA=25°C), 2.5 A (TA=70°C)
Drain-Source On-State ResistanceTyp 0.085 Ω, Max 0.10 Ω (VGS=10 V, ID=3.2 A); Typ 0.110 Ω, Max 0.13 Ω (VGS=4.5 V, ID=2.8 A)
Gate Threshold VoltageMin 1 V (VDS=VGS, ID=250 μA)
PackageTSOP-6
Operating Junction and Storage Temperature Range-55 to 150 °C
RoHS ComplianceLead (Pb)-Free Version is RoHS Compliant
Gate-Source Voltage±20 V
Pulsed Drain Current15 A
Maximum Power Dissipation2 W (TA=25°C), 1.3 W (TA=70°C)
Gate-Body LeakageMax ±100 nA (VDS=0 V, VGS=±20 V)
Zero Gate Voltage Drain CurrentMax 1 μA (VDS=48 V, VGS=0 V); Max 50 μA (VDS=48 V, VGS=0 V, TJ=150°C)
Forward TransconductanceTyp 8 S (VDS=4.5 V, ID=3.2 A)
Total Gate ChargeTyp 8 nC, Max 16 nC (VDS=30 V, VGS=10 V, ID=3.2 A)
Gate ResistanceTyp 1 Ω, Max 3.9 Ω
Maximum Junction-to-Ambient Thermal ResistanceMax 62.5 °C/W (t ≤ 5 sec); Typ 106 °C/W (Steady State)
Maximum Junction-to-Lead Thermal ResistanceTyp 35 °C/W (Steady State)
Diode Forward VoltageMax 1.2 V (IS=1.7 A, VGS=0 V)
All parameters (7)ExpandCollapse
Power
Continuous Drain Current (TJ =150°C) TA =25°C3.2 A
Drain-Source Voltage60 V
Gate-Source Voltage±20 V
Maximum Power Dissipation TA =25°C2 W
Environment and package
Operating Junction and Storage Temperature Range-55 to 150 °C
PackageTSOP-6
Other
Drain-Source On-State Resistance (VGS=10 V, ID=3.2 A)0.10 Ω (Max)

Pinout and package

N-Channel MOSFET
N-Channel MOSFET
Package: TSOP-6
PinNameFunctionSource
1Drain
2Drain
3Gate
4Source
5Drain
6Drain

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