Hologram, Inc.United States
GLOBAL IOT SIM 2FF/3FF/4FF
All alternatives
View full reportTechnical parameters
| Environment and package | |
|---|---|
| Operating Temperature | - |
| Package | Box |
| Size / Dimension | 5mm L x 6mm W x 0.82mm H |
| Other | |
| Carrier Network | - |
| Class | - |
| Core Processor | - |
| Features | - |
| Format | 2FF (Mini), 3FF (Micro), 4FF (Nano) |
| Memory | - |
| Mfr | Hologram, Inc. |
| Network Technology | 2G, 3G, 4G LTE IOT |
| Product Status | Obsolete |
| Series | - |