Chip Quik Inc.United States
SMD SOLDERING PRACTICE KIT STENC
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Inner Dimension | - |
| Outer Dimension | 2.000" L x 2.000" W (50.80mm x 50.80mm) |
| Package | Bulk |
| Thermal Center Pad | - |
| Other | |
| Material | Stainless Steel |
| Mfr | Chip Quik Inc. |
| Pitch | - |
| Product Status | Active |
| Series | Proto-Advantage ST |
| Thickness | 0.0040" (0.102mm) |
| Type | - |
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