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Technical parameters

Environment and package
Inner Dimension-
Outer Dimension5.000" L x 4.000" W (127.00mm x 101.60mm)
PackageBulk
Thermal Center Pad-
Other
MaterialStainless Steel
MfrChip Quik Inc.
Pitch-
Product StatusActive
Series-
Thickness0.0040" (0.102mm)
Type-

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