Telink(泰凌微电子)China
TL322x series SoC is compatible with a variety of mainstream wireless communication standards and industrial alliance specifications, including Bluetooth LE, Zigbee, RF4CE, Thread, Matter, and 2.4GHz proprietary protocols. By integrating multi-protocol functions into a single chip, the TL322x series brings advantages such as multi-protocol compatibility, cross-ecosystem interconnection, and high-efficiency performance to wireless IoT devices, making it an ideal choice for high-performance wireless IoT.
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Key specs
RAM256 ~ 384 kB
| GPIO | 22 / 33 / 40 / 64 |
| MCU | Dual Core, RISC-V 32-bit |
| NVM | 1024KB / 1536KB / 2560KB / 512KB |
| Protocol | Bluetooth 6.0 |
| SRAM | 256KB / 384KB |
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DatasheetDatasheet · 21.2 MB · 2026-09-23DatasheetDatasheet · 16.8 MB · 2026-09-23DatasheetDatasheet · 1.4 MB · 2026-09-23User ManualUser Manual · 13.8 MB · 2026-09-23User ManualUser Manual · 12.8 MB · 2026-09-23Application NoteApplication Note · 3.4 MB · 2026-09-23MarketingMarketing · 3.4 MB · 2026-09-23MarketingMarketing · 3.2 MB · 2026-09-23
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