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Technical parameters

Power
IC-最大集电极电流0.5A
VCEO-CE结击穿电压50V
AC and DC characteristics
fT-变换频率NMHZ
Environment and package
封装类型1SOIC
封装类型2DIP
封装类型3TSSOP
Other
引脚数量116
引脚数量216
引脚数量316

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