All alternatives

View full report

Technical parameters

Environment and package
PackageBag
Package AcceptedNon Specific
Size / Dimension1.000" L x 0.701" W (25.40mm x 17.80mm)
Other
Board Thickness0.031" (0.79mm) 1/32"
MaterialFR4 Epoxy Glass
MfrCapital Advanced Technologies
Number of Positions7
Pitch-
Product StatusActive
Proto Board TypeThrough Hole to SIP
Series4000, UNI-SIP™

Documents

No documents are linked to this part yet.